国际交流计划引进项目

| Solder Anisotropic Conductive Films

| Atomic Layer Deposition based Photodetectors

| 3D Near Field Electrospining

| Electronic Skin

 John A. Rogers 院士        Yonggang Huang 院士            Wei Huang 院士                  Yunqi Liu 院士                 Xue Feng 教授

2014.9-2017.8  KAIST  Materials Science and Engineering    Ph.d  

2012.9-2014.8  KAIST  Materials Science and Engineering   Master

2008.9-2012.8    HIT     Electronic Packaging Technology     Bachlor

Steering committee members - The 20th International Conference on Electronic Materials and Packaging (EMAP 2018)

Session Chair - University of Shanghai Cooperation Organization Nanotechnology, IEEE 3M-NANO, 2018

IEEE Membership

IEEE Electronics Packaging Society Membership

IEEE Council on RFID

IEEE Council on Superconductivity

IEEE Nanotechnology Council

IEEE Sensors Council

IEEE Young Professionals

Steering committee members - International Conference on Electronic Materials and Packaging (EMAP)

ACS Applied Materials & Interfaces

Nanotechnology

RSC Advances

IEEE Sensors Journals

IEEE Transactions on Nanotechnology

Journal of Materials Science: Materials in Electronis

IEEE Transactions on Components, Packaging and Manufacturing Technology

Nanomanufacturing and Metrology

Journal of Modern and Applied Physics