张墅野 中国
电子封装专业青年教师
讲师
目前就职材料科学与工程学院
所在学科 材料科学与工程
永久地址 http://homepage.hit.edu.cn/zhangshuye

Basic information


Lecturer at State Key Laboratory of Advanced Welding and Joining 2017

Member at IEEE Electronics Packaging Society 2016

Senior Member at Chinese Society of Micro-Nano Technology 2018


Education background

2014.9-2017.8  KAIST  Materials Science and Engineering    Ph.d  

2012.9-2014.8  KAIST  Materials Science and Engineering   Master

2008.9-2012.8    HIT     Electronic Packaging Technology     Bachlor

Research areas

Electrohydrodynamic printing

Working experience

2017.9 - Present  State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Lecturer

Conference member

2018 The 20th International Conference on Electronic Materials and Packaging (EMAP) - Steering committee member

2018 IEEE 3M-NANO University of Shanghai Cooperation Organization Nanotechnology - Session Chair

Academic member

Senior member at Chinese Society of Micro-Nano Technology 

IEEE Membership

IEEE Electronics Packaging Society Membership

IEEE Council on RFID

IEEE Council on Superconductivity

IEEE Nanotechnology Council

IEEE Sensors Council

IEEE Young Professionals

Honors

哈尔滨工业大学2009-2010“校自强之星”荣誉称号
哈尔工业大学校团委2010-2011科技创新部部长和校科协主席
全韩学人学者联谊会2011-2017KAIST分会会长
2017年“博士后国际交流计划”引进项目资助
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